Fragility of Pb-free Solder Joints
(SMTnet) Recent
investigations have revealed that Pb-free solder
joints may be fragile, prone to premature
interfacial failure particularly under shock
loading, as initially formed or tend to become so
under moderate thermal aging. This study
explores this in depth.
Effects of Lead Free Solders on Imaging
Characteristics of the Agilent 5DX Laminographic
X-ray Test
(Agilent Technologies) The
electronics industry is under pressure to migrate
solder processes away from the usage of eutectic
tin-lead solder and towards utilization of lead-free
compounds.
Test and Inspection as Part of the Lead-free
Manufacturing Process
(Agilent
Technologies) This paper addresses issues that will
impact defect levels and defect spectrum during the
transition to lead-free manufacturing. It also
addresses different test and inspection systems'
readiness to test lead-free printed circuit board
assemblies.
The Transition to Lead-Free: Lead-Free Soldering and
the 5DX
(Agilent Technologies)
Presentation from the 2005 5DX Users Conference
covering lead-free status worldwide, lead-free
defects, test strategy considerations, lead-free
test and inspection studies, 5DX lead-free
confirmation and adjustment panel.
Overcoming Lower Wetting Forces of Pb-Free Alloys
(Circuits Assembly) Severe process changes mean more
defects and call for greater test measures. This
Agilent submitted article was written by Stig Oresjo
for the Lead-Free Test Column in the February 2005
Edition of Circuits Assembly.
How AOI keeps Pb-free Process in Line
(Circuits Assembly) Article on AOI's process control
contribution during lead-free transition. What role
AOI can play as process characterization.
Pb-Free's Impacts on Test and Inspection
(Circuits Assembly) With lead-free PCBA It
will be more important to select optimal test
strategies and more defects may also increase
work-load on test, inspection and the rework
process.
The Importance of Test and Inspection When
Implementing Lead-Free Manufacturing
(Agilent Technologies) There have been many papers,
articles, and studies about process issues,
reliability issues, repair issues, and of merits of
different alloys. However there has been very little
attention on impacts on test and inspection when
going lead-free. This paper addresses that missing
piece.
Using Lead-Free PCB Finishes at Manufacturing
In-circuit Test Stage
(Agilent
Technologies) The purpose of this document is
to share experiences and educate engineers regarding
different PCB surface finishes and the specific
changes required in the PCB build process to allow
for ICT.
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A Study of Lead-Free Wave Soldering
(AIM) As lead-free in wave soldering increases,
questions about copper dissolution into lead-free
alloys have arisen. This study explores this
question and provides data and discussion to support
the industry issue.
Eliminate Lead-free Wave Soldering
(Indium) The advent of Lead-Free Soldering presents
many manufacturers with the need to Wave Solder
using Lead-Free Alloys. These alloys melt and are
soldered at temperatures well above conventional
SnPb processing temperatures. This creates several
well-documented problems. This article offers proven
and practical alternatives to the Lead-Free wave
Solder Process.
Solder Paste Evaluation Techniques for Pb-Free
(Indium) With the July 2006 lead-free transition the
two biggest material concerns involve solder paste
and components. This document provides practical
recommendations for evaluating Pb-free solder pastes
and ensuring that the selected solder paste will
deliver assembly yields comparable to, or better
than, the incumbent Sn/Pb solder paste.
Lead Free production, not a piece of cake!
(EMSnow) PCB production has not been without its
share of problems and hurdles, but perhaps the
biggest hurdle to date is producing a lead free PCB.
By Lars-Olof Wallin, IPC European Representative
Improving Lead-free Joint Quality with Nitrogen
(SMT) Nitrogen inerting can reduce
defects in lead-free reflow soldering. However, it
is claimed that many solder pastes either do not
need nitrogen, or work equally well in air. This
article compares joint quality when reflowed in
nitrogen vs. air.
Using SPI to Identify Root Causes
(Circuits Assembly) It is crucial that manfacturers
understand how Pb-free will impact the end-of-line
quality based on specific root causes found at paste
deposition. This article explores this concept and
provides discussion on Pb-free defect prevention.
Are you Read for the RoHS Directive?
(
Electronics Weekly ) Visit the Q&A section from Dr.
RoHS to for a great discussion on RoHS preparedness
and other lead-free related questions.
Dr. Lasky's Lead-Free Blog
(Indium)
Visit the blog often for discussion on process and
lead-free. By Dr. Ron Lasky.
Lead-free Solder and the Rework Process
(Surface Mount Technology) There is no doubt that
lead-free solders will affect soldering and rework
equipment negatively. This article explores some
issues that may arise, potential solutions and many
other discussion points on the transition to
lead-free.
PCB Designer's Notebook: SMT Land Patterns for
Lead-free
(Surface Mount Technology)
Designers have expressed concern regarding the
impact of the lead-free soldering process on the SMT
land-pattern geometry furnished on existing and
future circuit board designs. This article esplores
some concerns and potential solutions.
01005s and Lead-Free Solder
(Assembly)
Tiny 01005s are challenging for any electronics
assembly process, but they’re even more so if that
process is lead-free.
Conquer Tombstoning in Lead-Free Soldering
(Indium) Tombstoning has been plaguing the
surface mount assembly industry for decades. With
smaller devices and the onset of lead-free
tombstoning becomes a great concern. This article
explores tombstoning for SnAgCu lead-free solders.
Lead-Free Soldering of Chip-Scale Packages
(Indium) There are a number of promising Pb-free
alloys that may be considered viable for soldering
CSPs. This article explores many facets of these
considerations.
Case Study - Implementation of Pb-free solder paste
in a real manufacturing environment
(EMS Now) A valuable review of a case study from
manufacturer X who is in a suitable informed
position to select a lead-free paste to meet all of
the process and quality requirements. By Brian
Toleno.
Case Study 2 - Implementation of Pb-free solder
paste in a real manufacturing environment
(EMS Now) A valuable review of a case study from
manufacturer Y who has quite different requirements
for the lead-free solder pastes, and so different
process evaluations were applied. By Brian Toleno.
Speedline Technologies Completes Study on Lead-Free
Process Optimization
(Speedline
Technologies Inc) Speedline Technologies Inc. in
cooperation with Agilent Technologies, concluded a
three month Design of Experiment (DOE) to understand
and quantify variables in a lead-free manufacturing
process A report of findings will be presented at
the SMTA International Conference in Chicago in
September 2005.
Lead-free and Process Blog
(Speedline
Technologies) Visit the blog often for discussion on
process and lead-free. By Dr. Gerald Pham-Van-Diep
and Joe Belmonte
Agilent Technologies and Speedline Technologies to
Collaborate
(Agilent Technologies)
Agilent Technologies and Speedline Technologies Inc.
announce their collaboration in the lead-free
process development and characterization of printed
circuit board assemblies (PCBAs).
The Formal Development of a Pb-Free Electronics
Manufacturing Operation
(Speedline
Technologies, Cookson Performance Solutions) The
transition of an entrenched Pb-based electronics
manufacturing model to a fully integrated Pb-free
manufacturing operation will require significant and
coordinated modification to many elements of
currently operating electronics manufacturing
organizations. This article explores this in detail.
Lead-free SMT Soldering Defects How to Prevent
Them
(ACI) The lead-free SMT process
differs in numerous ways. A good understanding of
these differences will enable process engineers to
bring about the necessary changes to the SMT process
and reduce soldering defects, increase lead-free
assembly reliability and maintain production yields.
Optimizing Stencil Design for Lead-Free SMT
Processing
(Cookson Electronics)
Discussion of optimal stencil design for lead-free
processing.
Voiding: Occurrence and relaibility issues with
lead-free
(LeadFreeMagazine) This
study discusses voiding and lead-free. By Martin
Wickham.
Squeegee Blade Performance for Lead-Free Solder
Paste
(Photo Stencil) This study
compares the performance of five different squeegee
blades. By William E. Coleman, Ph.D.
Stencil and Squeegee Blade Considerations for
Lead-Free Solder Paste Printing
(Photo
Stencil, Heraeus) This study focuses on the stencil
and squeegee blade and their impact on the lead free
sold paste printing process. By Coleman and Lathrop.
Practical Lead-Free Implementation
(Speedline and Cookson ) This paper reviews six
major considerations for implementing lead-free
soldering processes. By Belmonte, Shea, Barton.
Effects of Cooling Slopes in Lead Free Reflow
(Speedline) This paper evaluation the
effect of variable cooling slopes on lead free
solder joints. By Appel, Formella, and Johnson.
PCB Surface Finish Options for Lead-free
Manufacturing
(EMS Now) Changes are
being made to surface finishes on printed circuit
boards (PCBs) to make them compatible with
lead-free. This article reviews the pros and cons.
By Brian Toleno.
Optimizing Pb-Free SMT Process Parameters
(Circuit Assembly) A Taguchi approach
reveals the most important process steps ... for
lead-free soldering. By Buonomo, Schiavo, Rotulo.
Lead-free wave soldering: Is process changeover
really simple?
(Reed Business
Informatin/SEHO Seitz & Hohnerlein GmbH)
Wave-soldering process, compared to reflow process,
is subjected to several critical factors.
3D X-ray Tests and Analyses of Lead-Free PBGA
(Plastic Ball Grid Array) Package Solder Joints
(Agilent Technologies) Presented at SMTA
International Conference, Chicago, September 26-29,
2004
Update of Global Trends in Lead-Free Soldering
(Agilent Technologies) Presented at SMTA
International Conference, Chicago, September 26-29,
2004
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